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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 17    No. 2    April 2007

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Effects of deformation on microstructures and properties
of submicron crystalline Cu-5%Cr alloy
HE Wen-xiong(贺文雄), WANG Er-de(王尔德), CHEN Hui(陈 晖),
YU Yang(于 洋), LIU Jing-lei(刘京雷)

School of Materials Science and Engineering, Harbin Institute of Technology,
Harbin 150001, China

Abstract:Warm extrusion of submicron crystalline Cu-5%Cr from 100 ℃ to 600 ℃ was investigated. The effects of different extrusion ratios and different extrusion temperatures on microstructures and properties of submicron crystalline Cu-5%Cr were studied. The microstructures of the extruded Cu-5%Cr were characterized by backscattered electron images(BSE) and transmission electron microscopy(TEM). The mechanical properties of the extruded Cu-5%Cr were measured by means of microhardness and tension test. The results show that, the deformation, dynamic recovery and dynamic recrystallization of the extruded Cu-5%Cr are mainly produced in Cu matrix. The higher extrusion ratio leads to more uniform microstructure and finer Cu grains. When being extruded in the range of 100−600 ℃, dynamic recovery of Cu is the dominant process, and dynamic recrystallization of Cu occurred above 300 ℃ is far from end. The most part of microstructure of as-extruded Cu-5%Cr is subcrystallines produced by dynamic recovery, only a few recrystallines exist, and the average size of these grains is not larger than 400 nm. With extrusion temperature rising, the tensile strength and microhardness of Cu-5%Cr decrease, and elongation increases gradually.

 

Key words: Cu-Cr alloy; submicron crystalline; extrusion; dynamic recovery; dynamic recrystallization

ISSN 1672-7029
CN 43-1423/U

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