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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 17    No. 3    June 2007

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Effect of ultrasonic power on wedge bonding strength and interface microstructure
WANG Fu-liang(王福亮), LI Jun-hui(李军辉),
HAN Lei(韩 雷), ZHONG Jue(钟 掘)

School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China

Abstract:During the aluminum wire wedge bonding, the ultrasonic power and bonding strength were obtained. Based on those data, the relationship between ultrasonic power and bonding strength was studied. The results show that: 1) ultrasonic power is affected by ultrasonic power ratio and other uncontrolled factors such as asymmetric substrate quality, unstable restriction on the interface between wedge tool and aluminum wire; 2) when ultrasonic power is less than 1.0 W, increasing ultrasonic power leads to increasing bonding strength and decreasing failure bonding; on the contrary, when ultrasonic power is greater than 1.6 W, increasing power leads to decreasing bonding strength and increasing failure bonding; 3) only when ultrasonic power is between 1.0 W and 1.6 W, can stable and high yield bonding be reached. Finally, the microstructure of bonding interface was observed, and a ring-shaped bond pattern is founded in the center and friction scrape besides the ring area.

 

Key words: bonding strength; ultrasoninc power; wedge bonding; microstructure

ISSN 1672-7029
CN 43-1423/U

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