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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 16    No. 1    February 2006

    

    

Influence of interfacial reaction between molten
SnAgCu solder droplet and
Au/Ni/Cu pad on IMC evolution
LI Fu-quan(李福泉), WANG Chun-qing(王春青)

Microjoining Laboratory, School of Material Science and Engineering,
Harbin Institute of Technology,Harbin 150001, China

Abstract:Intermetallic compounds(IMC) formed at Sn-Ag-Cu solder droplet/pad interface during wetting reaction were investigated. Comparative studies of the IMC evolution during reflow and aging were also conducted. The results show that the wetting reaction between molten solder droplet and pad leads to the formation of Au-Sn compound at interface, but Au element is not fully consumed during wetting reaction. After reflow, all Au layer disappears from the interface, Au element is dissolved into solder and Au-Sn intermetallic compounds are precipitated in the bulk. Reaction between Ni layer and Sn-Ag-Cu solder leads to the formation of (CuxNi1-x)6Sn5 layer at interface during reflow. According to the thermodynamic-kinetic of interfacial reaction, the wetting reaction at solder droplet/pad interface influences the phase selectivity of IMC evolution during reflow and aging process.

 

Key words: SnAgCu solder; Au/Ni/Cu pad; solder droplet; intermetallic compounds; interfacial reaction; reflow; ageing

ISSN 1672-7029
CN 43-1423/U

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