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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 16    No. 1    February 2006

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Process of electroless plating Cu-Sn-Zn ternary alloy
HE Xin-kuai(何新快)1, 2,CHEN Bai-zhen(陈白珍)2, HU Geng-sheng(胡更生)1DENG Ling-feng(邓凌峰)1, 2, ZHOU Ning-bo(周宁波)2, TIAN Wen-zeng(田文增)2

1. School of Packaging and Printing, Zhuzhou Institute of Technology, Zhuzhou 412008, China;
2. School of Metallurgical Science and Engineering, Central South University, Changsha 410083, China

Abstract:Cu-Sn-Zn ternary alloy layer with 10 μm thickness was prepared through electroless plating method. The influences of process conditions including the concentration of metallic salts, reductant and complex agent on Cu-Sn-Zn alloy were studied in details. The stability to bear color changes and corrosion resistance of Cu-Sn-Zn film layer were studied through air-exposure experiment and electrochemical analyses test respectively. The results show that the performances of Cu-Sn-Zn film layer are obviously superior to brass matrix. By use of SEM,EDS and XRD, the morphology, microstructure and chemical composition were investigated. The results show that complex agent can increase the content of Sn and Zn, improve the evenness and compactness and decrease needle holes, therefore the properties of electroless plating layer such as the stability to bear color changes and corrosion resistance are improved remarkably. The probable mechanism of complex agent was discussed.

 

Key words: electroless plating; Cu-Sn-Zn ternary alloy; color-change resistance; corrosion resistance

ISSN 1672-7029
CN 43-1423/U

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