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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 16    No. 2    April 2006

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Atomic diffusion properties in wire bonding
LI Jun-hui(李军辉), WANG Fu-liang(王福亮), HAN Lei(韩 雷), DUAN Ji-an(段吉安), ZHONG Jue(钟 掘)

College of Mechanical-Electronical Engineering, Central South University, Changsha 410083, China

Abstract:The lift-off characteristics at the interface of thermosonic bond were observed by using scanning electron microscope (JSM-6360LV). The vertical section of bonding point was produced by punching, grinding and ion-sputter thinning, and was tested by using transmission electron microscope (F30). The results show that the atomic diffusion at the bonded interface appears. The thickness of Au/Al interface characterized by atomic diffusion is about 500 nm under ultrasonic and thermal energy. The fracture morphology of lift-off interface is dimples. The tensile fracture appears by pull-test not in bonded interface but in basis material, and the bonded strength at interface is enhanced by diffused atom from the other side.

 

Key words: thermosonic bond; atomic diffusion; dimples, bonding strength

ISSN 1672-7029
CN 43-1423/U

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