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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 18    No. 5    October 2008

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Rapid electroplating of Cu coatings by mechanical attrition method
NING Zhao-hui(宁朝晖), HE Ye-dong(何业东)

Beijing Key Laboratory for Corrosion, Erosion and Surface Technology, University of Science and Technology Beijing, 100083 Beijing, China

Abstract:The compact Cu coating with smooth surface and refined grain was prepared at high current density by mechanical attrition enhanced electroplating(MAEE) process. The mechanical attrition(MA) action was supplied by the vertical movement of glass balls on the sample surface with a special vibrating frequency. The plating bath was CuSO4 and H2SO4. It is demonstrated from field emission scanning electron microscopy(FESEM) results that the new coating shows smooth and refined surface morphology in high speed MAEE process. The further studies show that the spherical grain or pillar-shape grain can be obtained by traditional electroplating process at the current density of 200−600 mA/cm2. And the coatings are loosen, porous and easy to brush off. The pyramid-shape grain with diameter of less than 1 μm was obtained by MAEE process under the same condition. And the coatings are compact and pore-free. The rapid electroplating process can be obtained by MA action.

 

Key words: mechanical attrition; electroplating; Cu coating

ISSN 1672-7029
CN 43-1423/U

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