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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 18    No. 5    October 2008

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Effect of solidification on solder bump formation in solder jet process: Simulation and experiment
TIAN De-wen(田德文), WANG Chun-qing(王春青), TIAN Yan-hong(田艳红)

School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China

Abstract:To investigate the influence of the solidification on the solder bump formation in the solder jet process, the volume of fluid (VOF) models of the solder droplets impinging onto the fluxed and non-fluxed substrates were presented. The high speed camera was used to record the solder impingement and examine the validity of the model. The results show that the complete rebound occurs during the process of the solder droplet impinging onto the fluxed substrate, whereas a cone-shaped solder bump forms during the process of the solder droplet impinging onto the non-fluxed substrate. Moreover, the solder solidification results in the lift-up of the splat periphery and the reduction in the maximum spread factor.

 

Key words: solder bump; solder jet; solidification; simulation; volume of fluid(VOF)

ISSN 1672-7029
CN 43-1423/U

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