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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 15    No. 3    June 2005

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Growth of brass nanofilms sputtered on organic substrate
CHEN Zhen-xing(陈振兴)1, 2, WANG Ling-sen(王零森)1,
 HUANG Bai-yun(黄伯云)1

1. State Key Laboratory for Powder Metallurgy, Central South University, 
Changsha 410083, China; 
2. School of Chemistry and Chemical Engineering, Central South University, 
Changsha 410083, China

Abstract:The growth of brass nanofilms sputtered on acrylics substrate was studied through experimental investigation of the effect of sputtering voltage, target-to-substrate distance, chamber pressure and sputtering time on the content, growth rate and surface morphology of brass nanofilms. The results show that compared with original brass target, Cu content in brass nanofilms changes by no more than 6.23%(mass fraction). High sputtering voltage and short target-to-substrate distance help to improve brass nanofilm deposition rate. There exists an optimal chamber pressure where deposition rate of nanofilm reaches the maximum. The key factor affecting surface morphology is the kinetic energy of sputtering particles. Low sputtering voltage, large target-to-substrate distance and low chamber pressure are very important for the formation of the high-quality brass nanofilms. The brass films prepared under the conditions of sputtering voltage 1.6kV, target-to-substrate distance 2.5cm, chamber pressure 10Pa and sputtering time 20min, possess following characteristics: smooth and uniform surface, thickness of 41nm and Cu content of 71.0%(mass fraction).

 

Key words: brass; nanofilm; sputtering; morphology; substrate

ISSN 1672-7029
CN 43-1423/U

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