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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 15    No. 6    December 2005

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Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder
XUE Song-bai(薛松柏)1, YU Sheng-lin(禹胜林)2, WANG Xu-yan(王旭艳)1
LIU lin(刘 琳)1, HU Yong-fang(胡永芳)1, YAO Li-hua(姚立华)1

1. College of Materials Science and Technology, 
Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China; 
2. 14th Research Institute, China Eletronics Technology Group Corporation, 
Nanjing 210013, China

Abstract: Several important properties of the micron-powdered Sn-Ag-Cu-Ce solder, including the spreadability, spreading ratio, wetting time, and melting point, were investigated for verifying the effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder. The solidus and the liquidus of the micron-powdered Sn-Ag-Cu-Ce solder are 193.6℃ and 218.4℃, respectively, about 28℃ and 3℃ lower than the melting point of the block Sn-Ag-Cu solder, which reminds the existence of the surface effect of the micron-powdered solder. By adding Ce into Sn-Ag-Cu alloy, its wetting time on pure copper can be obviously decreased. For the Sn-Ag-Cu-0.03%Ce, the soldering temperature is 250℃, and the wetting time on pure copper is close to 1s, with the soldering temperature approaching to 260℃, the wetting time is dropped to 0.8s, which is close to the wetting time, 0.68s, of Sn-Pb solder at 235℃.

 

Key words:  lead-free solder; Sn-Ag-Cu-Ce alloy; wetting time; solidus; liquidus

ISSN 1672-7029
CN 43-1423/U

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