您目前所在的位置:首页 - 期刊简介 - 详细页面

铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 11    No. 4    August 2001

[PDF Download]    [Flash Online]

    

Finite element simulation for mechanical
response of surface mounted solder joints
under different temperature cycling
MA Xin(马 鑫)1,2, QIAN Yi-yu(钱乙余)1, F. Yoshida3

1. National Key Laboratory of Welding,
Harbin Institute of Technology,Harbin 150001, P.R.China;
2. Research and Analysis Center, Electronic Product Reliability and
Environmental Testing Research Institute, Guangzhou 510610, P.R.China;
3. Department of Mechanical Engineering, Hiroshima University,
HigashiHiroshima 739, Japan

Abstract:Nonlinear finite element simulation for mechanical response of surface mounted solder joint under different temperature cycling was carried out. Seven sets of parameters were used in order to evaluate the influence of temperature cycling profile parameters. The results show that temperature cycling history has significant effect on the stress response of the solder joint. Based on the concept of relative damage stress proposed by the authors, it is found that enough high temperature holding time is necessary for designing the temperature cycling profile in accelerated thermal fatigue test.

 

Key words: finite element simulation; surface mounted solder joint; thermal cycling; mechanical response

ISSN 1672-7029
CN 43-1423/U

主管:中华人民共和国教育部 主办:中南大学 中国铁道学会 承办:中南大学
湘ICP备09001153号 版权所有:《铁道科学与工程学报》编辑部
------------------------------------------------------------------------------------------
地 址:湖南省长沙市韶山南路22号 邮编:410075
电 话:0731-82655133,82656174   传真:0731-82655133   电子邮箱:jrse@mail.csu.edu.cn