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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 11    No. 6    December 2001

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Bond strength of W-Cu/CuCr integrated material
FAN Zhi-kang(范志康),  LIANG Shu-hua(梁淑华), XUE Xu(薛  旭)

School of Materials Science and Engineering,
Xi′an University of Technology, Xi′an  710048, P.R.China

Abstract: The bond strength of W-Cu/CuCr integrated material was investigated. The results show that the fracture of W-Cu/CuCr integrated material often takes place at W-Cu/CuCr interface. Some alloying elements enhance the bond of W and CuCr alloy, which results in the increase of the strength of the W-Cu/CuCr interface. And the fracture of the W-Cu/CuCr integrated material occurs in the CuCr alloy part, not at the W-Cu/CuCr interface. Chromium in CuCr alloy part of the integrated material can improve Cr diffusing from the CuCr alloy to W-Cu composite and can be alloyed (near the W-Cu/CuCr interface) in the W-Cu composite. Thus the strength of W-Cu/CuCr interface is also increased.

 

Key words:  bond strength; W-Cu; CuCr; integrated material

ISSN 1672-7029
CN 43-1423/U

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