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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 11    No. 6    December 2001

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Numeric simulation of thickness of intermetallic compounds in
interface zone of diffusion bonding for Cu and Al
LI Ya-jiang(李亚江), WU Hui-qiang(吴会强), CHEN Mao-ai(陈茂爱), FENG Tao(冯  涛)

Key Lab of Liquid Structure and Heredity of Materials, Ministry of Education,
School of Materials Science and Engineering, Shandong University, Jinan 250061, P.R.China

Abstract: Numeric model of intermetallic compound formation and growth in the vacuum diffusion bonding of copper and aluminum was established, and proved by EPMA and micro-hardness test etc. The numeric simulation of thickness of the intermetallic compound results in accord with the tests well. This study provides some references to determine welding parameters in the vacuum diffusion bonding of Cu/Al dissimilar materials.

 

Key words:  vacuum diffusion bonding; intermetallic compounds; numeric simulation

ISSN 1672-7029
CN 43-1423/U

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