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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 12    No. 2    April 2002

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Microstructures and transformation
characteristics of-thin films of
TiNiCu shape memory alloy
CHENG Xiu-lan(程秀兰)1, XU Dong(徐  东)1, CAI Bing-chu(蔡炳初)1,
WANG Li(王  莉)1, CHEN Jian(陈  鉴)1, LI Gang(李  刚)

1.Information Storage Research Center,Shanghai Jiaotong University;
Thin Film and Microfabrication Opening Lab, National Education Ministry,
Shanghai 200030, China;
2.Analysis and Test Center, Shanghai Jiaotong University,
Shanghai 200030, China

Abstract:Both sputtering conditions and crystallizing temperatures have great influence on the microstructures and phase transformation characteristics for Ti51Ni44Cu5. By means of the resistance-temperature measurement, X-ray diffraction and atomic fore microscopic study, the results indicate that the transformation temperatures of the thin films increase and the “rock candy” martensitic relief is more easily obtained with promoting the sputtering Arpressure, sputtering power, or crystallizing temperature. However, when sputtering Ar pressure, sputtering power, or crystallizing temperature are lower, a kind of “chrysanthemum” relief, which is related with Ti-rich GP zones, is much easier to be observed. The reason is that during crystallization process, both of the inherent compressive stresses introduced under the condition of higher sputtering pressure or higher crystallizing temperature are helpful to the transition from GP zones to Ti2(NiCu) precipitates and the increase of the transformation temperatures. The addition of copper to substitute for 5% nickel in mole fraction can reduce the transformation hysteresis width to about 10~15℃.

 

Key words: shape memory alloys; thin films; TiNiCu; microstructures; phase transformation; sputtering

ISSN 1672-7029
CN 43-1423/U

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