您目前所在的位置:首页 - 期刊简介 - 详细页面

铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 19    Special 1    September 2009

[PDF Download]    [Flash Online]

    

Voltage-induced material removal mechanism of copper for electrochemical-mechanical polishing applications
Sang-Jun HAN1, Yong-Jin SEO2

1. Nano-Information Material & Device Laboratory, Daebul University, Chonnam, 526-702, Korea;
2. School of Fusion Technology, Daebul University, Chonnam, 526-702, Korea

Abstract:The current—voltage (IV) curves, such as linear sweep voltammetry (LSV) and cyclic voltammetry (CV), were employed to evaluate the effect of electrolyte concentration on the electrochemical reaction trend. From the IV curve, the electrochemical states of active, passive, transient and trans-passive region could be characterized. And then, the mechanism of the process of voltage-induced material removal in electrochemical mechanical polishing (ECMP) of copper was investigated. Scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) analyses were used to observe the surface profile. Finally, the oxidation and reduction processes of the Cu surface were monitored by the repetition of anodic and cathodic potential from cyclic voltammetry (CV) method in acid- and alkali-based electrolyte.

 

Key words: electrochemical mechanical polishing; linear sweep voltammetry; cyclic voltammetry; HNO3; KNO3; electrolyte

ISSN 1672-7029
CN 43-1423/U

主管:中华人民共和国教育部 主办:中南大学 中国铁道学会 承办:中南大学
湘ICP备09001153号 版权所有:《铁道科学与工程学报》编辑部
------------------------------------------------------------------------------------------
地 址:湖南省长沙市韶山南路22号 邮编:410075
电 话:0731-82655133,82656174   传真:0731-82655133   电子邮箱:jrse@mail.csu.edu.cn