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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 17    Special 1    November 2007

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Effect of tensile stress on microstructure evolution of
Al-Cu-Mg-Ag alloys
ZHOU Jie(周  杰), LIU Zhi-yi(刘志义), LI Yun-tao(李云涛),

LIU Yan-bin(刘延斌), XIA Qing-kun(夏卿坤), DUAN Shui-liang(段水亮)

Abstract:The effect of tensile stress on thermal microstructure evolution of Ω phase in an Al-Cu-Mg-Ag alloy with high Cu/Mg ratio and higher Ag content was investigated by transmission electron microcopy (TEM) .The samples were aged at 200 ℃ for 1 h (T6 condition), then thermal exposed at 250 ℃ for 100 h with and without a tensile stress (130 MPa), respectively. The results indicate that Ω precipitates uniformly disperse in the matrix as a major precipitate after artificially aging at 200 ℃ for 1 h (T6 condition). Exposed at 250 ℃ for 100 h without stress, Ω precipitates dissolve dramatically. Whereas, during stress exposure they coarsen unexpectedly rather than dissolve into matrix. It can be deduced that the stress retards the redissolution of Ω phase.

 

Key words: Al-Cu-Mg-Ag alloy; Ω phase; thermal exposure; tensile stress
 

ISSN 1672-7029
CN 43-1423/U

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