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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 9    No. 4    December 1999

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Interfacial reactions and diffusion path in partial transient liquid-phase bonding of Si_3N_4/Ti/Ni/Ti/Si_3N_4
Chen Zheng(陈铮); Zhao Qizhang(赵其章); Fang Fang(方芳); Lou Hongqing(楼宏青); Sui Runzhou(睦润舟); Li Zhizhang(李志章)

Department of Welding and Materials Engineering; East China Shipbuilding Institute; Zhenjiang 212003; P. R. China;
Department of Mechanical Engineering; South China University of Scien

Abstract:The interfacial reactions in partial transient liquid-phase bonding of Si_3N_4 ceramics with Ti/Ni/Ti interlayers were studied by means of scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and X-ray diffractometry (XRD). It was shown that the interfacial structure of Si_3N_4/TiN/Ti_5Si_3+Ti_5Si_4 + Ni_3Si/ (NiTi ) /Ni_3Ti/ Ni was formed after bonding. The activation energies for TiN layer and the mixed reaction layer of Ti_5Si_3 + Ti_5Si_4 + Ni_3Si are 546. 8 kJ/mol and 543. 9 kJ/mol, respectively. The formation and transition processes of interface layer sequence in the joint were clarified by diffusion path. An important characteristic, which is different from the conventional brazing and soid-state diffusion bonding, has been found, i. e., during the partial transient liquid-phase bonding, not only the reaction layers which have formed grow, but also the diffusion path in the subsequent reaction changes because of the remarkable variation of the concentration on the metal side.  

 

Key words:  ceramic joining; transient liquid-phase bonding; interfacial reactions; diffusion

ISSN 1672-7029
CN 43-1423/U

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