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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 17    Special 1    November 2007

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Preparation for intermetallic powders of Cu-Sn and Cu-Ni-Sn systems via solid-liquid reaction milling technique
CHEN Ding(陈  鼎), WU Wei(吴  薇), CHEN Zhen-hua(陈振华),
FU Ding-fa(傅定发), CHEN Gang(陈  刚)

School of Materials Science and Engineering, Hunan University, Changsha 410082, China

Abstract:The Cu-Sn binary intermetallic powders were obtained via a patented reaction ball milling technique. The Sn melt reacted with the solid-state Cu during the milling process at different temperatures for different intervals. Two kinds of binary intermetallics were obtained. For 12 h, Cu6Sn5 was prepared by milling Sn melt at 573 K while Cu3Sn by milling Sn melt at 773 K. And a mixture of Cu6Sn5 and Cu3Sn was fabricated at 673 K. All these intermetallic powders had mean grain sizes of less than 100 nm. A finer microstructure was obtained by milling Sn melt blended with 20%(mass fraction) Ni powders at 573 K for 12 h. The reaction mechanism and advantages were discussed in comparison with that of high-energy ball milling. The results show the solutionizing of Ni powders in the Cu6Sn5 intermetallic.

 

Key words: Cu-Sn binary alloy; intermetallics powder; solid-liquid reaction milling; mechanochemical effect

ISSN 1672-7029
CN 43-1423/U

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