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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 17    Special 1    November 2007

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Surface characterization and electrical resistivity of electroless plating nanocrystalline copper films on glass
1. Key Laboratory of Automobile Materials, Ministry of Education, College of Materials Science and Engineering,
 Jilin University, Changchun 130025, China;

2. Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences,
Changchun 130033, China;
3. Graduate School, Chinese Academy of Sciences, Beijing 100039, China

Abstract:Nanocrystalline copper films were prepared on the glass by electroless plating technique. The surface characterization of copper films with different deposition time was studied by field emission scanning electron microscopy (FESEM) and atomic force microscopy (AFM). The results indicate that the copper films have a (111) texture. A continuous and smooth film forms on the glass substrate at deposition times of 5 min. The surface roughness of as-deposited copper films becomes rougher with large nodules as the deposition time increases. According to Fuchs–Sondheimer (F–S), Mayadas–Shatzkes (M–S) theory and a combined model, the grain boundary reflection coefficient (R) is calculated in the range of 0.40−0.75. The theoretical analysis based on the experimental results show that the grain boundaries contribute mainly to the increase of electrical resistivity of nanocrystalline copper film compared with the film surfaces.

 

Key words: nanocrystalline copper; electroless plating; surface roughness; electrical resistivity

ISSN 1672-7029
CN 43-1423/U

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