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铁道科学与工程学报

JOURNAL OF RAILWAY SCIENCE AND ENGINEERING

Vol. 17    Special 1    November 2007

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Development of copper coatings on molybdenum powders by
 electroless plating technique
WANG Guang-jun(王光君), WANG De-zhi(王德志)

Schools of Materials Science and Engineering, Central South University, Changsha 410083, China

Abstract:Mo powders with average particle size of 3 μm were attempted to coat with copper by electroless plating technique. The effect of the solution composition and plating conditions on the electroless copper plating was studied. The uncoated and coated powders were subjected to the microstructural studies by SEM and the phases were analyzed by XRD. The results indicate that the Mo powders are coated with copper, at the same time, Mo-Cu composite powders with Cu content ranging from 15% to 85% (mass fraction) can be obtained. The optimal values of pH, HCHO concentration and temperature are in the ranges of 12−13, 22−26 ml/L and 60−65 ℃, respectively. The diffusion-shrinkage autocatalytic model is suggested for the growth mechanism of electroless coating over the surface.

 

Key words: Mo-Cu; electroless plating copper; powders; growth mechanism

ISSN 1672-7029
CN 43-1423/U

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